ADC UD-50 Specifications download pdf (Page 51)

Data Sheet AD9259

Rev. E | Page 51 of 52

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2

WITH EXCEPTION TO EXPOSED PAD DIMENSION.

FORPROPERCONNECTIONOF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

5.55

5.50 SQ

5.45

0.50

0.40

0.30

0.23

0.18

0.80 MAX

0.65 TYP

5.50 REF

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM VIEW)

0.20 REF

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

12° MAX

TOP VIEW

0.60 MAX

PIN 1

INDICATOR

0.50

REF

PIN 1

INDICATOR

0.22 MIN

7.10

7.00 SQ

6.90

6.85

6.75 SQ

6.65

02-23-2010-C

Figure 71. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

7 mm × 7 mm Body, Very Thin Quad

(CP-48-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Notes

Temperature

Range Package Description

Package

Option

AD9259ABCPZ-50

−40°C to +85°C 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-48-8

AD9259ABCPZRL7-50

−40°C to +85°C 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7” Tape and Reel CP-48-8

AD9259-50EBZ

Evaluation Board

Z = RoHS Compliant Part.

Interposer board (HSC-ADC-FIFO5-INTZ) is required to connect to HSC-ADC-EVALCZ data capture board.

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